Thin Film Processes, Volume 1John L. Vossen, Werner Kern Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
From inside the book
Results 1-3 of 27
Page 260
... studies of III- V compound semiconductors [ 27–32 ] , II - VI materials [ 33 ] , and silicon [ 34-37 ] . Table I summarizes the results of these studies . In some cases , the results obtained are as expected , but in others they are ...
... studies of III- V compound semiconductors [ 27–32 ] , II - VI materials [ 33 ] , and silicon [ 34-37 ] . Table I summarizes the results of these studies . In some cases , the results obtained are as expected , but in others they are ...
Page 271
... Studies of Transport Phenomena in Cold - Wall CVD Reactors a . Flow Visualization . In these studies [ 55 , 61 , 62 ] , TiO2 smoke was em- ployed to visualize flow patterns in the reactor . The main conclusions are that there exists a ...
... Studies of Transport Phenomena in Cold - Wall CVD Reactors a . Flow Visualization . In these studies [ 55 , 61 , 62 ] , TiO2 smoke was em- ployed to visualize flow patterns in the reactor . The main conclusions are that there exists a ...
Page 319
... studies could in many cases result in an improved and more economical CVD product . We hope that our discussion of fundamentals have indicated some of the areas where basic studies would be fruitful . Modern thin - film technology is ...
... studies could in many cases result in an improved and more economical CVD product . We hope that our discussion of fundamentals have indicated some of the areas where basic studies would be fruitful . Modern thin - film technology is ...
Contents
Glow Discharge Sputter Deposition | 13 |
Equipment Configuration | 31 |
Preconditioning of Targets Substrates and Systems for Film | 41 |
Copyright | |
10 other sections not shown
Other editions - View all
Common terms and phrases
Å/min alloys anode Appl applications argon atoms bias bombardment cathode Chem chemical coatings composition compounds current density deposition rate dielectric discharge power effect electric Electrochem electron electroplating energy Epitaxial etch rate etchants etching processes film deposition flow rate GaAs gases glow discharge polymerization H₂ H₂O heating HNO3 increase ion beam deposition ion source ionization layer mA/cm² magnetic field magnetron mask metal mTorr N₂ nitride O₂ operation oxide photoresist Phys planar plasma plasma etching plating PM sputtering polishing polymer polymer deposition potential pressure Proc produce ratio reactants reaction reactive sputtering reactor Section semiconductor shown in Fig silicon silicon nitride SiO2 solution species sputter deposition Sputter Gun sputtering yield starting material stoichiometry substrate susceptor target surface techniques Technol temperature thermal thickness Thin Film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage wafer York µm/min