Thin Film Processes, Volume 1John L. Vossen, Werner Kern Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
From inside the book
Results 1-3 of 56
Page 14
... target surface which may influence the growth of films profoundly . These include : secondary electron emission , second- ary positive and / or negative ion emission , emission of radiation ( photons , x rays ) , reflection of incident ...
... target surface which may influence the growth of films profoundly . These include : secondary electron emission , second- ary positive and / or negative ion emission , emission of radiation ( photons , x rays ) , reflection of incident ...
Page 20
... target surface - not to that contributed by the glow discharge . 1. Photons Both ultraviolet ( UV ) and visible radiation are emitted from sputtering targets [ 69-76 ] . Sputtered metal and elemental semiconductor atoms leaving the target ...
... target surface - not to that contributed by the glow discharge . 1. Photons Both ultraviolet ( UV ) and visible radiation are emitted from sputtering targets [ 69-76 ] . Sputtered metal and elemental semiconductor atoms leaving the target ...
Page 192
... target surface is enriched in the lower sputter yield constitu- ent . After this layer reaches equilibrium , the sputtered flux usually matches the target composition [ 46 , 62a ] . A dependence of sputtered film composition on angle of ...
... target surface is enriched in the lower sputter yield constitu- ent . After this layer reaches equilibrium , the sputtered flux usually matches the target composition [ 46 , 62a ] . A dependence of sputtered film composition on angle of ...
Contents
Glow Discharge Sputter Deposition | 13 |
Equipment Configuration | 31 |
Preconditioning of Targets Substrates and Systems for Film | 41 |
Copyright | |
10 other sections not shown
Other editions - View all
Common terms and phrases
Å/min alloys anode Appl applications argon atoms bias bombardment cathode Chem chemical coatings composition compounds current density deposition rate dielectric discharge power effect electric Electrochem electron electroplating energy Epitaxial etch rate etchants etching processes film deposition flow rate GaAs gases glow discharge polymerization H₂ H₂O heating HNO3 increase ion beam deposition ion source ionization layer mA/cm² magnetic field magnetron mask metal mTorr N₂ nitride O₂ operation oxide photoresist Phys planar plasma plasma etching plating PM sputtering polishing polymer polymer deposition potential pressure Proc produce ratio reactants reaction reactive sputtering reactor Section semiconductor shown in Fig silicon silicon nitride SiO2 solution species sputter deposition Sputter Gun sputtering yield starting material stoichiometry substrate susceptor target surface techniques Technol temperature thermal thickness Thin Film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage wafer York µm/min