Thin Film Processes, Volume 1John L. Vossen, Werner Kern Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page 219
... techniques , was perhaps the earliest application of electroplating . Until about 1960 these techniques relied on making the nonconductor electrically conductive by means of metallic paints , rubbing with graphite , or " silvering ...
... techniques , was perhaps the earliest application of electroplating . Until about 1960 these techniques relied on making the nonconductor electrically conductive by means of metallic paints , rubbing with graphite , or " silvering ...
Page 401
... Techniques of Etching A. Chemistry of Etching 401 403 403 B. Factors Affecting Etching Reactions 404 C. Etching Techniques and Processes 405 D. Pattern Delineation Etching for Thin Films 407 E. Surface Contamination and Cleaning Techniques ...
... Techniques of Etching A. Chemistry of Etching 401 403 403 B. Factors Affecting Etching Reactions 404 C. Etching Techniques and Processes 405 D. Pattern Delineation Etching for Thin Films 407 E. Surface Contamination and Cleaning Techniques ...
Page 497
... techniques . Improved lithographic techniques have permitted a reduction in feature size in photo and electron sensitive re- sists into a range where conventional liquid phase chemical etching is no longer a viable means of pattern ...
... techniques . Improved lithographic techniques have permitted a reduction in feature size in photo and electron sensitive re- sists into a range where conventional liquid phase chemical etching is no longer a viable means of pattern ...
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Å/min alloys anode Appl argon atoms cathode chemical coatings compounds current density cylindrical-post magnetron deposition rate effect elec electric Electrochem electroless electrolytic electroplating energy Epitaxial erosion etch rate etchants etching field lines film deposition flow gas pressure gases glow discharge glow discharge polymerization H₂ H₂O heating increase ion beam deposition ion bombardment ion source ionization J. A. Thornton layer mA/cm² magnetic field magnetron magnetron sputtering material metal mTorr N₂ negative neutral nitride O₂ operation oxide Phys planar magnetron plasma plating PM sputtering polymer potential power density power supply Proc reaction reactive gas reactive sputtering reactor region secondary electrons Section semiconductor shown in Fig silicon SiO2 solution sputter deposition Sputter Gun sputter yield sputtering gas stoichiometry substrate target surface Technol temperature thermal thickness Thin Film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage York