Thin Film Processes, Volume 1Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page 153
These conductances depend on the thermal resistance ( thickness x thermal
conductivity ) of the materials involved . Table V lists calculated maximum power
densities that can be applied to various materials for a 100°C temperature
gradient ...
These conductances depend on the thermal resistance ( thickness x thermal
conductivity ) of the materials involved . Table V lists calculated maximum power
densities that can be applied to various materials for a 100°C temperature
gradient ...
Page 187
Thermal cycling leads to embrittlement and failure , with exposure to oxygen or
more reactive gases shortening filament life greatly . Magnetic fields may be
supplied by an external solenoid , usually air cooled , or by permanent magnets ...
Thermal cycling leads to embrittlement and failure , with exposure to oxygen or
more reactive gases shortening filament life greatly . Magnetic fields may be
supplied by an external solenoid , usually air cooled , or by permanent magnets ...
Page 418
Thermal , HF / H20 , P / H , 0 : SiO , + POC13 ( 02 ) at 1000°C ( 193 ) . Thermal , P
- etch : Si0 , + P2O3 ( N , ) at 1020°C ( 194 ) ( from Kern ( 27 ) . This figure was
originally presented at the 149th Spring Meeting of The Electrochemical Society ...
Thermal , HF / H20 , P / H , 0 : SiO , + POC13 ( 02 ) at 1000°C ( 193 ) . Thermal , P
- etch : Si0 , + P2O3 ( N , ) at 1020°C ( 194 ) ( from Kern ( 27 ) . This figure was
originally presented at the 149th Spring Meeting of The Electrochemical Society ...
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Contents
Glow Discharge Sputter Deposition | 12 |
Glow Discharges | 24 |
Equipment Configuration | 31 |
Copyright | |
10 other sections not shown
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Common terms and phrases
addition alloys anode Appl applications atoms cathode charge chemical coatings composition compounds concentration constant containing density dependent deposition rate effect electric Electrochem electron energy Epitaxial etch rate etchants example factor flow formation gases given glass glow discharge heating higher important increase ion beam ionization layer less limited lower magnetic field magnetron material metal method negative nitride occurs operation oxide pattern Phys plasma plating polishing polymer polymerization positive potential prepared pressure produce properties range ratio reaction reactive reactor reducing Reference region relatively resistance semiconductor shown in Fig silicon solution species sputtering starting structure substrate surface Table target techniques Technol temperature thermal thickness Thin Thin Film tion typically um/min uniform usually vacuum vapor various voltage yield York
Bibliographic information
| Title | Thin Film Processes, Volume 1 Thin Film Processes, John L. Vossen |
| Editors | John L. Vossen, Werner Kern |
| Contributor | Elsevier Science & Technology (Firm) |
| Edition | 8, illustrated |
| Publisher | Academic Press, 1978 |
| Original from | the University of Michigan |
| Digitized | 10 Dec 2007 |
| ISBN | 0127282505, 9780127282503 |
| Length | 564 pages |
| Subjects | › Technology & Engineering / General |
| Export Citation | BiBTeX EndNote RefMan |