Thin film processes, Volume 1
Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process.
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Glow Discharge Sputter Deposition
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A/min Abstr alloys anode Appl applications argon atoms bias cathode Chem chemical coatings composition compounds current density deposition rate dielectric discharge power effect electric Electrochem electron electroplating energy Epitaxial Epitaxial Epitaxial Epitaxial etch rate etchant etching processes film deposition flow rate GaAs gases glow discharge polymerization heating increase ion beam deposition ion source ionization Kern layer magnetic field magnetron mask metal mTorr operation oxide photoresist Phys plasma etching plating PM sputtering polishing polymer polymer deposition potential power density power supply pressure Proc produce ratio RCA Rev reactants reaction reactive sputtering reactor Section semiconductor shown in Fig silicon nitride solution species sputter deposition Sputter Gun sputtering yield starting material stoichiometry substrate susceptor target surface techniques Technol temperature thermal thickness Thin Film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage wafer York