Thin Film Processes, Volume 1John L. Vossen, Werner Kern Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page 61
... uniformity of film deposition have been thoroughly reviewed by Maissel [ 5 , 9 ] , so only a summary is presented here . For a given target material both rate and uniformity are influenced by system geometry , target voltage ...
... uniformity of film deposition have been thoroughly reviewed by Maissel [ 5 , 9 ] , so only a summary is presented here . For a given target material both rate and uniformity are influenced by system geometry , target voltage ...
Page 144
... uniformity . Based on ring source analysis of Glang [ 53 ] . where n is the ring number . This results in an array of 2 - cm - wide rings with 2 cm spacing between rings . As Table III indicates , uniformity effi- ciency over a circular ...
... uniformity . Based on ring source analysis of Glang [ 53 ] . where n is the ring number . This results in an array of 2 - cm - wide rings with 2 cm spacing between rings . As Table III indicates , uniformity effi- ciency over a circular ...
Page 163
... uniformity of discharge exposure by varying the magnet arrangement and substrate- magnet spacing were evaluated in terms of the temperature uniformity achieved . The best uniformity obtained was 3 % over the 13 - cm width of the steel ...
... uniformity of discharge exposure by varying the magnet arrangement and substrate- magnet spacing were evaluated in terms of the temperature uniformity achieved . The best uniformity obtained was 3 % over the 13 - cm width of the steel ...
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Å/min alloys anode Appl argon atoms cathode chemical coatings compounds current density cylindrical-post magnetron deposition rate effect elec electric Electrochem electroless electrolytic electroplating energy Epitaxial erosion etch rate etchants etching field lines film deposition flow gas pressure gases glow discharge glow discharge polymerization H₂ H₂O heating increase ion beam deposition ion bombardment ion source ionization J. A. Thornton layer mA/cm² magnetic field magnetron magnetron sputtering material metal mTorr N₂ negative neutral nitride O₂ operation oxide Phys planar magnetron plasma plating PM sputtering polymer potential power density power supply Proc reaction reactive gas reactive sputtering reactor region secondary electrons Section semiconductor shown in Fig silicon SiO2 solution sputter deposition Sputter Gun sputter yield sputtering gas stoichiometry substrate target surface Technol temperature thermal thickness Thin Film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage York