Thin Film Processes, Volume 1John L. Vossen, Werner Kern Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page 37
... vacuum frequently , so it is advisable to include a shutoff valve between the head and the vacuum chamber to keep them under vacuum at all times . Many processes are affected by gas flow throughput , which deter- mines how fast ...
... vacuum frequently , so it is advisable to include a shutoff valve between the head and the vacuum chamber to keep them under vacuum at all times . Many processes are affected by gas flow throughput , which deter- mines how fast ...
Page 136
... vacuum chamber with power and coolant brought in via vacuum feedthroughs [ 16 , 24 ] . ( 2 ) The cathode and sur- rounding electrical insulator form part of the vacuum chamber wall so that high - voltage connections and coolant seals ...
... vacuum chamber with power and coolant brought in via vacuum feedthroughs [ 16 , 24 ] . ( 2 ) The cathode and sur- rounding electrical insulator form part of the vacuum chamber wall so that high - voltage connections and coolant seals ...
Page 137
... vacuum - to - coolant O - ring seals . Slight leakage through such seals may not be detected , and total seal failure can be catastrophic . The second design has the advantage of not requiring vacuum - to - cool- ant seals if a cathode ...
... vacuum - to - coolant O - ring seals . Slight leakage through such seals may not be detected , and total seal failure can be catastrophic . The second design has the advantage of not requiring vacuum - to - cool- ant seals if a cathode ...
Contents
Glow Discharge Sputter Deposition | 13 |
Equipment Configuration | 31 |
Preconditioning of Targets Substrates and Systems for Film | 41 |
Copyright | |
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Å/min alloys anode Appl applications argon atoms bias bombardment cathode Chem chemical coatings composition compounds current density deposition rate dielectric discharge power effect electric Electrochem electron electroplating energy Epitaxial etch rate etchants etching processes film deposition flow rate GaAs gases glow discharge polymerization H₂ H₂O heating HNO3 increase ion beam deposition ion source ionization layer mA/cm² magnetic field magnetron mask metal mTorr N₂ nitride O₂ operation oxide photoresist Phys planar plasma plasma etching plating PM sputtering polishing polymer polymer deposition potential pressure Proc produce ratio reactants reaction reactive sputtering reactor Section semiconductor shown in Fig silicon silicon nitride SiO2 solution species sputter deposition Sputter Gun sputtering yield starting material stoichiometry substrate susceptor target surface techniques Technol temperature thermal thickness Thin Film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage wafer York µm/min