Low-dielectric Constant MaterialsMaterials Research Society, 1999 - Electric insulators and insulation |
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Page 33
... function of aging time . Dielectric loss ( loss tangent ) determines the quality of the dielectric in terms of the dissipation of the signal into heat . Hrubesh et - al [ 22 ] reported loss values in the range of 0.0005 to 0.07 and a ...
... function of aging time . Dielectric loss ( loss tangent ) determines the quality of the dielectric in terms of the dissipation of the signal into heat . Hrubesh et - al [ 22 ] reported loss values in the range of 0.0005 to 0.07 and a ...
Page 36
... function of the degree of surface modification Figure 9 Water absorprtion as a function of porosity and surface modifier . Since the amount of adsorbed moisture is expected to scale with the surface area of the material , we fabricated ...
... function of the degree of surface modification Figure 9 Water absorprtion as a function of porosity and surface modifier . Since the amount of adsorbed moisture is expected to scale with the surface area of the material , we fabricated ...
Page 65
... function of the film density . measurement . As is schematically shown in Figure 4 , both the film strength and the adhesion are evaluated at the same time in this measurement ; a large value suggests that both properties are strong ...
... function of the film density . measurement . As is schematically shown in Figure 4 , both the film strength and the adhesion are evaluated at the same time in this measurement ; a large value suggests that both properties are strong ...
Contents
Porous Organosilicates for OnChip Dielectric Applications | 3 |
A New LowDielectric Constant Polymer Material K | 17 |
Wave Polymerization During Vapor Deposition of Porous | 23 |
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1999 Materials Research a-C:F film a-CN absorption adhesion promoter adsorption annealing as-deposited atoms barrier capacitance capacitors carbon chemical cm¹ Constant Materials curing temperature damascene debond decrease deposition rate device dielectric constant diffusion electrical Electron ellipsometry etching film expansion film thickness films deposited FLAC fluorine FOx films FTIR gate heating increase integration interface layer leakage current low dielectric constant low-k low-k materials Materials Research Society measured metal modulus moisture MSSQ nitride nitrogen oxide peak PECVD plasma treatment polarization polyimide polymer polymerization pore porogen porosity porous film PPSZ Proc ratio reduced refractive index resistance sample sccm Semiconductor shown in Figure shows Si-H bonds Si-O Si-O-Si SiCOH silica silicon silicon dioxide silsesquioxane SiO:F SiO2 SiOF films spectra spin coating sputtering stress substrate surface Symp Technology TEOS thermal conductivity thin films Torr voltage wafer xerogel xerogel films