Low-dielectric Constant MaterialsMaterials Research Society, 1999 - Electric insulators and insulation |
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Page 69
... low dielectric constant materials that can satisfy a number of diverse performance requirements necessary for successful integration into IC devices . This has led to extensive efforts to develop low k materials and the associated ...
... low dielectric constant materials that can satisfy a number of diverse performance requirements necessary for successful integration into IC devices . This has led to extensive efforts to develop low k materials and the associated ...
Page 137
... Symp . Proc . Vol . 565 © 1999 Materials Research Society Capacitance ( fF / μm ) layers ) . Using 137 *Integration of Low-Dielectric Constant Materials in Advanced Aluminum and Copper Interconnects B Zhao and M Brongo.
... Symp . Proc . Vol . 565 © 1999 Materials Research Society Capacitance ( fF / μm ) layers ) . Using 137 *Integration of Low-Dielectric Constant Materials in Advanced Aluminum and Copper Interconnects B Zhao and M Brongo.
Page 255
... low dielectric constant . The addition of fluorine was very effective to eliminate the Si - OH in the film and the disappearance of the Si - OH was the key factor to obtain low dielectric constant . A kinetic analysis of the process was ...
... low dielectric constant . The addition of fluorine was very effective to eliminate the Si - OH in the film and the disappearance of the Si - OH was the key factor to obtain low dielectric constant . A kinetic analysis of the process was ...
Contents
Porous Organosilicates for OnChip Dielectric Applications | 3 |
A New LowDielectric Constant Polymer Material K | 17 |
Wave Polymerization During Vapor Deposition of Porous | 23 |
Copyright | |
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1999 Materials Research a-C:F film absorption adsorbate adsorption annealing as-deposited atoms barrier calculated capacitance capacitors carbon chemical cm¹ Constant Materials damascene structure debond growth decrease density devices dielectric constant diffusion dual damascene interconnect Electron ellipsometry etch fabricated Figure film thickness films deposited fluorine FOx films FTIR increase integration interface layer leakage current low dielectric constant low-k low-k materials Materials Research Society measured modulus moisture moisture stress nitride oxide peak PECVD plasma treatment polyimide polymer polymerization pore porosity porous film Proc ratio reduced refractive index resistance sample sccm Semiconductor shown in Fig shows Si-H bonds Si-O Si-O-Si SiC:H SiCOH films silica silicon silicon dioxide SiO:F SiO2 SiOF films spectra spin coating sputtering stress substrate surface Symp tantalum nitride Technology TEOS thermal conductivity thermal stability thin films Torr ULSI voltage wafer xerogel xerogel films