Physical Design of Electronic Systems: Materials technology

addition polymerization adhesive alloys aluminum anode applied atoms behavior bond brittle carbon cathodic cell ceramic chain chemical constant cooling copper core corrosion covalent bonds crack creep crystal crystalline curve decrease deformation dependence dielectric diffusion dipole dislocation effect elastic electrical electron configuration electrons equation equilibrium eutectic example extruder fabric factor failure fatigue fiber fibrous composites fracture function glass glass transition temperature heat hydrogen increase interfacial ions joint lattice linear liquid load magnetic material matrix maximum mechanical properties melting point metal MN/m² modulus mold molecular weight molecules monomer N/m² occurs oxidation percent phase plane plastic polarization polycrystalline polyethylene polymerization pressure reaction reinforcement relative relaxation resin resistance result rubber screw shear modulus shear rate shear stress shown in Fig slip solid solution steel strain strength structure substrate surface temperature tensile strength tensile stress thermal thermoplastic thickness valence viscoelastic viscosity volume