Thin film processes, Volume 1
Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process.
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A/min Abstr alloys anode Appl applications argon atoms bias cathode Chem chemical coatings composition compounds current density deposition rate dielectric effect electric Electrochem electron electroplating energy Epitaxial Epitaxial Epitaxial Epitaxial etch rate etchant etching processes film deposition flow rate GaAs gases glow discharge polymerization heat increase ion beam deposition ion etching ion source ionization Kern layer magnetic field magnetron mask metal mTorr nitride oxide photoresist Phys planar plasma etching plating PM sputtering polishing polymer polymer deposition potential power density pressure Proc produce ratio RCA Rev reactants reaction reactive sputtering reactor rf sputtering Section Semiconductors shown in Fig SiH4 silicon silicon nitride solution species sputter deposition sputter etching Sputter Gun sputtering yield starting material stoichiometry substrate susceptor techniques temperature thermal thickness Thin Film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage wafer xm/min York