Thin Film Processes, Volume 1John L. Vossen, Werner Kern Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
From inside the book
Results 1-3 of 26
Page 430
John L. Vossen, Werner Kern. e . Chemical - Mechanical Polishing . Polishing by combined chemical and mechanical processes is usually the last step in preparing flat and spec- ular wafers in silicon device manufacture . The generally ...
John L. Vossen, Werner Kern. e . Chemical - Mechanical Polishing . Polishing by combined chemical and mechanical processes is usually the last step in preparing flat and spec- ular wafers in silicon device manufacture . The generally ...
Page 458
... Polishing ( 111 ) and ( ÏÏÏ ) faces [ 460 ] General etching [ 458 ] 15 ( CP - 4 ) 75HNO3 , 15HF , 15CH3COOH , 0.06 ... polishing General polishing [ 457 , 459 ] [ 452 ] [ 423 ] [ 402 , 461 ] 20 IHCI , 1HNO3 Etching ( 100 ) face ...
... Polishing ( 111 ) and ( ÏÏÏ ) faces [ 460 ] General etching [ 458 ] 15 ( CP - 4 ) 75HNO3 , 15HF , 15CH3COOH , 0.06 ... polishing General polishing [ 457 , 459 ] [ 452 ] [ 423 ] [ 402 , 461 ] 20 IHCI , 1HNO3 Etching ( 100 ) face ...
Page 458
... polishing ; etch [ 472 ] pits on ( 111 ) face 7 300 ml precip . silica , 90 ml HNO3 , 10 g AlCl3 / liter H2O 8 70Н2О , 30НСІ Chem . - mech . polishing , Poromeric disk , 240 r / min , 370 g / cm2 Rotating on Pellon cloth Polishing ...
... polishing ; etch [ 472 ] pits on ( 111 ) face 7 300 ml precip . silica , 90 ml HNO3 , 10 g AlCl3 / liter H2O 8 70Н2О , 30НСІ Chem . - mech . polishing , Poromeric disk , 240 r / min , 370 g / cm2 Rotating on Pellon cloth Polishing ...
Contents
J J CUOMO 11 IBM Thomas J Watson Research Center Yorktown | 11 |
Glow Discharges | 24 |
Equipment Configuration | 31 |
Copyright | |
8 other sections not shown
Other editions - View all
Common terms and phrases
Å/min alloys Amorphous anode Appl applications argon atoms bias cathode Chem chemical coatings composition compounds current density deposition rate dielectric discharge power effect electric Electrochem electron electroplating energy Epitaxial etch rate etchants etching processes film deposition flow rate GaAs gases glow discharge polymerization H₂ H₂O heating HNO3 increase ion beam deposition ion source ionization Kern layer magnetic field magnetron mask metal mTorr N₂ nitride O₂ operation oxide photoresist Phys planar plasma plasma etching plating PM sputtering polishing polymer polymer deposition potential pressure Proc produce ratio reactants reaction reactive sputtering reactor Section semiconductor shown in Fig silicon silicon nitride SiO2 solution species sputter deposition Sputter Gun sputtering yield starting material stoichiometry substrate susceptor target surface techniques Technol temperature thermal thickness Thin Film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage wafer York