Thin Film Processes, Volume 1John L. Vossen, Werner Kern Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page 159
... rf bias on insulating substrates . 2. Neutral Bombarding Species As ... sputtering gas and residual gases . Ions of the sputtered species can also drift to the substrate and ... Sputtering from Water II - 4 . PLANAR MAGNETRON SPUTTERING 159.
... rf bias on insulating substrates . 2. Neutral Bombarding Species As ... sputtering gas and residual gases . Ions of the sputtered species can also drift to the substrate and ... Sputtering from Water II - 4 . PLANAR MAGNETRON SPUTTERING 159.
Page 164
John L. Vossen, Werner Kern. Subsequently , rf PM deposition of Al2O3 [ 72 ] and SiO2 [ 29 , 60 ] were re- ported . A. Comparison of RF and DC PM Sputtering Planar magnetron sputtering with an rf potential on the cathode ( usually 13.56 ...
John L. Vossen, Werner Kern. Subsequently , rf PM deposition of Al2O3 [ 72 ] and SiO2 [ 29 , 60 ] were re- ported . A. Comparison of RF and DC PM Sputtering Planar magnetron sputtering with an rf potential on the cathode ( usually 13.56 ...
Page 166
... rf rates can be controlled in the same manner as in conventional rf deposition . The dc self - bias at the target may be useful for rate indication and control [ 66 ] . D. Power Supplies and Matching Networks In contrast to dc PM sputtering ...
... rf rates can be controlled in the same manner as in conventional rf deposition . The dc self - bias at the target may be useful for rate indication and control [ 66 ] . D. Power Supplies and Matching Networks In contrast to dc PM sputtering ...
Contents
J J CUOMO 11 IBM Thomas J Watson Research Center Yorktown | 11 |
Glow Discharges | 24 |
Equipment Configuration | 31 |
Copyright | |
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Å/min alloys Amorphous anode Appl applications argon atoms bias cathode Chem chemical coatings composition compounds current density deposition rate dielectric discharge power effect electric Electrochem electron electroplating energy Epitaxial etch rate etchants etching processes film deposition flow rate GaAs gases glow discharge polymerization H₂ H₂O heating HNO3 increase ion beam deposition ion source ionization Kern layer magnetic field magnetron mask metal mTorr N₂ nitride O₂ operation oxide photoresist Phys planar plasma plasma etching plating PM sputtering polishing polymer polymer deposition potential pressure Proc produce ratio reactants reaction reactive sputtering reactor Section semiconductor shown in Fig silicon silicon nitride SiO2 solution species sputter deposition Sputter Gun sputtering yield starting material stoichiometry substrate susceptor target surface techniques Technol temperature thermal thickness Thin Film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage wafer York