Thin Film Processes, Volume 1John L. Vossen, Werner Kern Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page 21
... Surface Layers and Diffusion 1. Multicomponent Targets The bombardment of a multicomponent solid surface with ions or neu- tral atoms alters the chemical composition of the surface due to the differ- ence in the sputter yield of the ...
... Surface Layers and Diffusion 1. Multicomponent Targets The bombardment of a multicomponent solid surface with ions or neu- tral atoms alters the chemical composition of the surface due to the differ- ence in the sputter yield of the ...
Page 412
... surfaces includes theoretical and practical aspects related to surface contamination on a variety of materials [ 81 ] . Ryan et al . [ 82 ] and De Forest [ 83 ] have described the preparation of clean surfaces prior to photoresist ...
... surfaces includes theoretical and practical aspects related to surface contamination on a variety of materials [ 81 ] . Ryan et al . [ 82 ] and De Forest [ 83 ] have described the preparation of clean surfaces prior to photoresist ...
Page 548
... surface region after growth , or by the use of a faster etching sacrificial surface layer . These techniques have been described fully in the literature on wet etching [ 116-118 ] ( see Chapter V - 1 ) . VI . ADVANTAGES AND ...
... surface region after growth , or by the use of a faster etching sacrificial surface layer . These techniques have been described fully in the literature on wet etching [ 116-118 ] ( see Chapter V - 1 ) . VI . ADVANTAGES AND ...
Contents
J J CUOMO 11 IBM Thomas J Watson Research Center Yorktown | 11 |
ix | 75 |
FREDERICK A LOWENHEIM 209 637 West 7th Street Plainfield | 115 |
Copyright | |
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Å/min alloys Amorphous anode Appl argon atoms bias cathode Chem chemical coatings composition compounds current density deposition rate dielectric discharge power effect electric Electrochem electron electroplating energy Epitaxial etch rate etchants etching processes film deposition flow rate GaAs gases glow discharge polymerization H₂ H₂O heating HNO3 increase ion beam deposition ion source ionization layer magnetic field magnetron mask metal mTorr N₂ nitride O₂ operation oxide photoresist Phys planar plasma plasma etching plating PM sputtering polishing polymer polymer deposition potential power density pressure Proc produce ratio reactants reaction reactive sputtering reactor Section semiconductor shown in Fig silicon silicon nitride SiO2 solution species sputter deposition Sputter Gun sputtering yield starting material stoichiometry substrate susceptor target surface techniques Technol temperature thermal thickness Thin Film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage wafer York µm/min