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Introduction to Hybrids
Substrate Materials and Properties
ThickFilm Design Guidelines
ThinFilm Design Guidelines
Laser Trimming of Hybrid Circuits
alumina applied assembly attached beam lead bonding area bonding pad bonding tool capacitance capacitor ceramic chip device circuit board circuitry coating conductor materials connection cost crossover cycle deposited die attach dielectric constant discrete components dissipation Dissipation factor electrical electronic epoxy failure rate film circuit film resistor firing flip chips flow function glass gold heat sink heat source hybrid circuit hybrid design hybrid microcircuit insulating integrated circuit interconnect laser trimming layer layout line widths manufacturing mesh metal microwave MTTF OOOOO operation oxide package palladium parameters pattern plastic plating polyimide probe properties reflow reliability resistor material resistor pastes screen printing semiconductor sheet resistivity shown in Figure silicon solder sputtering square count squeegee substrate tantalum tape techniques termination thermal conductivity thermal resistance thermocompression thick thick-film thick-film capacitor thin thin-film resistors thin-film substrate tolerances transistors typical ultrasonic usually voltage wire bonding