The Science and Design of Engineering Materials |
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Page 575
... heat generated by this process can be substantial . If the heat is not removed from the vicinity of the active devices by thermal conduction through the substrate , it can result in an increase in the temperature of the device and a ...
... heat generated by this process can be substantial . If the heat is not removed from the vicinity of the active devices by thermal conduction through the substrate , it can result in an increase in the temperature of the device and a ...
Page 576
... heat from the heat source to your hand , so it remains cool even though the pan gets hot . In this section we will explain the link between atomic structure and the ability of a material to conduct heat . The conduction of thermal ...
... heat from the heat source to your hand , so it remains cool even though the pan gets hot . In this section we will explain the link between atomic structure and the ability of a material to conduct heat . The conduction of thermal ...
Page 590
... Heat transfer across two noncontacting materials is not possible by conduction , but rather , heat transfer may occur by radiation or convection . By evacuating the space between the layers the convective heat loss is minimized . By ...
... Heat transfer across two noncontacting materials is not possible by conduction , but rather , heat transfer may occur by radiation or convection . By evacuating the space between the layers the convective heat loss is minimized . By ...
Contents
Materials Science and Engineering | 2 |
CHAPTER | 4 |
CHAPTER | 12 |
Copyright | |
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alloy aluminum anion applications atoms band band gap BCC structure bond-energy curve brittle Calculate carbon cation ceramics chain Chapter charge carriers classes of materials close-packed coefficient component composition compound conductivity containing corrosion covalent bonds crack crystal structure crystalline cubic decreases defects density determined dielectric diffusion dipole direction discussed dislocation ductility elastic elastic modulus electrical electronegative energy engineering Equation equilibrium eutectic eutectoid Example Problem fatigue ferromagnetic fibers fraction fracture glass glass transition temperature grain boundaries heat impurity increases interface interstitial ions lattice liquid load magnetic martensite matrix mechanical melting metal microstructure modulus molecules nucleation occurs oxide pearlite peritectic phase diagram plane polyethylene polymers primary bonds properties quench ratio reaction region resistance result schematic secondary bonds semiconductors shown in Figure shows silicon SiO2 solid solution steel strain strength stress surface tensile tetrahedral transformation unit cell vacancies valence band