Thin Film ProcessesRemarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page 40
... magnetron sputtering targets of all types, resistance-heated filament, rf-heated or electron-beam evaporation sources, or gaseous reagents Of the type normally used for chemical vapor deposition. Problems arise mainly with those vapor ...
... magnetron sputtering targets of all types, resistance-heated filament, rf-heated or electron-beam evaporation sources, or gaseous reagents Of the type normally used for chemical vapor deposition. Problems arise mainly with those vapor ...
Page 73
... (1976). J. E. Greene, Surf. Sci., to be published. R. J. Gambino and J. J. Cuomo, J. Vac. Sci. Technol. 15, 296 (1978). //-2 Cylindrical Magnetron Sputtering JOHN A. THORNTON AND ALAN S. 11-1. GLOW DISCHARGE SPUTTER DEPOSITION 73.
... (1976). J. E. Greene, Surf. Sci., to be published. R. J. Gambino and J. J. Cuomo, J. Vac. Sci. Technol. 15, 296 (1978). //-2 Cylindrical Magnetron Sputtering JOHN A. THORNTON AND ALAN S. 11-1. GLOW DISCHARGE SPUTTER DEPOSITION 73.
Page 75
... Magnetron Apparatus A. Cylindrical-Post Magnetrons B. Cylindrical-Hollow Magnetrons C. End Containment D. Magnetic Materials E. Cathode Fabrication Plasma Discharge r=oanvow> Erosion and Deposition Profiles A. Erosion Profile B ...
... Magnetron Apparatus A. Cylindrical-Post Magnetrons B. Cylindrical-Hollow Magnetrons C. End Containment D. Magnetic Materials E. Cathode Fabrication Plasma Discharge r=oanvow> Erosion and Deposition Profiles A. Erosion Profile B ...
Page 76
... magnetrons in sputtering technology can best be understood by reviewing the limitations of conventional planar diodes ... MAGNETRON SPUTTERI NG TYPICAL SPUTTERING C NDITI NS *1.0. Fig. 1. Schematic representation of the plasma in planar ...
... magnetrons in sputtering technology can best be understood by reviewing the limitations of conventional planar diodes ... MAGNETRON SPUTTERI NG TYPICAL SPUTTERING C NDITI NS *1.0. Fig. 1. Schematic representation of the plasma in planar ...
Page 77
... magnetron geometry. Both post [6—12] and hollow [l3] cathodes have been investigated for sputtering. However their performance is limited by end losses. Remarkable performance is achieved when end losses are eliminated. High currents ...
... magnetron geometry. Both post [6—12] and hollow [l3] cathodes have been investigated for sputtering. However their performance is limited by end losses. Remarkable performance is achieved when end losses are eliminated. High currents ...
Contents
9 | |
Chemical Methods of Film Deposition | 207 |
Physicalchemical Methods of Film Deposition | 333 |
Etching Processes | 399 |
Index | 557 |
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Common terms and phrases
A/min Abstr alloys anode Appl argon atoms cathode Chem chemical Chemical vapor deposition coatings composition compounds configuration current density deposition rate effect efficiency electric Electrochem electron electroplating energy Epitaxial etch rate etchants etching processes film deposition first flow rate flux GaAs gas flow gases glow discharge polymerization heat increase ion beam deposition ion etching ionization Kern layer magnetic field magnetron mask metal mTorr nitride oxide photoresist Phys planar plasma etching plating PM sputtering pm/min polishing polymer polymer deposition potential pressure Proc produce profile ratio RCA Rev reaction reactive reactive sputtering reactor reflected Semiconductors shown in Fig SiH4 silicon silicon nitride SiO2 solution species sputter deposition sputter etching Sputter Gun sputtering yield starting material stoichiometry substrate sufficient susceptor techniques Technol temperature thermal thickness thin film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage wafer York